Quality Elastic Self-adhesive Thermal Conductive Pad with Thermal Conductivity 1.0 W/m-K to 9.0 W/m-K for Heat Dissipation factory
Quality Elastic Self-adhesive Thermal Conductive Pad with Thermal Conductivity 1.0 W/m-K to 9.0 W/m-K for Heat Dissipation factory
Quality Elastic Self-adhesive Thermal Conductive Pad with Thermal Conductivity 1.0 W/m-K to 9.0 W/m-K for Heat Dissipation factory
Quality Elastic Self-adhesive Thermal Conductive Pad with Thermal Conductivity 1.0 W/m-K to 9.0 W/m-K for Heat Dissipation factory

Elastic Self-adhesive Thermal Conductive Pad with Thermal Conductivity 1.0 W/m-K to 9.0 W/m-K for Heat Dissipation

PRODUCT MODEL
SR-DTXJ
country of origin
CHINA
MOQ
2000
payment method
T/T

Product Details

Highlight:

Elastic Thermal Conductive Pad

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Self-adhesive Thermal Pad

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Thermal conductivity 1.0 W/m-K to 9.0 W/m-K Conductive Rubber Compound
Product Description
Detailed Specifications And Features
Elastic Thermally Conductive Pad with Resin Carrier
Our thermal conductive pads are engineered elastic solutions designed for efficient heat transfer in demanding industrial applications. These self-adhesive pads utilize resin as a carrier with advanced thermally conductive fillers to deliver superior thermal management performance.
Product Overview
Thermal conductive pads are elastic thermal interface materials manufactured with resin carriers and specialized thermally conductive fillers. Their low hardness and excellent elasticity enable them to conform to uneven or irregular device surfaces, effectively compensating for design tolerances and eliminating air gaps between heat-generating components and heat dissipation structures.
This advanced thermal management solution ensures complete filling of air gaps between heat sources and heat sinks or metal casings, facilitating efficient heat transfer to cooling structures. This results in improved device operating efficiency and extended component lifespan across various industrial applications.
Technical Specifications:
• Thermal Conductivity: 1.0 W/m-K to 9.0 W/m-K
• Thickness Range: 0.5 mm to 10 mm
• Self-adhesive design requires no backing adhesive
• Optional: Single-sided non-adhesive or single-sided adhesive variants available
Key Product Features
  • Excellent surface wettability for maximum contact
  • Low hardness with high flexibility and conformability
  • Significantly reduced surface thermal resistance
  • Superior compressibility and resilience
  • Effective electrical insulation properties
  • Good surface adhesion without additional adhesives
Industrial Applications
  • 5G communication base stations and wireless infrastructure
  • Optical modules and telecommunications equipment
  • LCD, PDP, and television display systems
  • Industrial power modules and control systems
  • LED lighting assemblies and thermal management
  • Automotive electronics and battery systems
  • Hard disk drives and solid-state storage devices
  • Heat dissipation between components and heat sinks/housings
Our thermal conductive pads provide reliable thermal interface solutions for heat-generating components across multiple industries, ensuring optimal performance and longevity of electronic systems through efficient heat transfer technology.
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