Thermally conductive tape with thermal conductivity ≥0.6 W/mk, heat resistance up to 120℃, and strong adhesion 1000-2000 g/25mm for electronic devices
Product Details
Thermal conductivity ≥0.6 W/mk tape
,Heat resistance up to 120℃ tape
,Strong adhesion 1000-2000 g/25mm tape
- Superior thermal conductivity for efficient heat dissipation
- Strong adhesive properties for secure component mounting
- Quick and uniform heat transfer capabilities
- Enhanced equipment stability and reliability
- Easy application and reliable performance
| Property | Unit | Standard Value | Test Method |
|---|---|---|---|
| Thickness | mm | 0.15-0.5 | GB/T 7125-2014 |
| 180° Peeling Force | g/25mm | 1000-2000 | GB/T 2792-2014 |
| Initial Adhesion Force | # | 3-6 # Steel Ball | GB/T 4852-2002 |
| Adhesive Force | H | ≥24 | GB/T 4851-2014 |
| Withstand Voltage | KV/mm | 3.5-8 | - |
| Thermal Conductivity | W/mk | ≥0.6 | - |
| Heat Resistance | ℃ | Long-term 80℃ Short-term 120℃ |
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